language
Products
Adhesives for Elastomeric Bonding
Product | Type | Characteristics & Applications |
6210AB | Two-Part Epoxy | Medium viscosity. High strength/toughness, excellent mechanical and environmental resistance, good insulation. Ideal for industrial assemblies requiring strong bonding of plastics and metals. |
6250AB | Two-Part Epoxy | Long working time, high strength, chemical/solvent resistance. Superior mechanical and electrical performance. |
6202AB | Two-Part Epoxy | Colorless, transparent, fast-curing, moisture-resistant. Forms tough, transparent layers after room-temperature curing. Strong adhesion to multiple substrates. |
6220AB | Two-Part Epoxy | Transparent, low viscosity, good flow. Impact-resistant, ideal for glass bonding. |
6242AB | Two-Part Epoxy | Medium viscosity, long working time, flexible. Suitable for low-stress, high-impact bonding of dissimilar materials (e.g., deformed PCBs, transformers). |
6260AB | Two-Part Epoxy | High strength, thixotropic, moisture-resistant. Excellent adhesion to various substrates. |
E-8110 | One-Part Epoxy | High strength, toughness, heat-cured. Resists impact and flow during heating. Ideal for aluminum and carbon fiber bonding. |
E-8150 | One-Part Epoxy | High viscosity, anti-sagging, maintains performance at high temperatures. Heat-cured, withstands 180°C. Used for structural bonding/sealing of electrical components. |
E-8120 | One-Part Epoxy | High viscosity. Bonds oily or challenging surfaces. Heat-cured, chemical/impact-resistant. |
E-8154 | One-Part Epoxy | High strength, thixotropic, heat-resistant. For copper, aluminum, fiberglass, and oily steel surfaces. |
E-8117 | One-Part Epoxy | Paste-like. Superior peel/impact resistance, electrical performance, and chemical resistance. Heat-resistant; bonds metals, glass, ceramics, plastics. Ideal for magnetic steel and silicon steel lamination. |
E-8132 | One-Part Epoxy | Medium viscosity, low-temperature fast-curing. Suitable for heat-sensitive components (e.g., memory cards, CCD/CMOS modules). |
E-8210 | One-Part Epoxy | High Tg, low CTE, reworkable. For underfill, chip packaging, and BGA applications. |